Submit Your Abstract Now Through - August 18, 2025
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Group: MEMS and NEMS Technology (MN)

Home Group: MEMS and NEMS Technology (MN)

The MN Group program warmly invites abstract contributions in the fields of micro/nanoelectromechanical systems (MEMS/NEMS) and heterogeneous integration, encompassing fundamental studies of novel materials and processes, devices, and emerging functions and applications. Our program highlights interdisciplinary studies of microsystems and nanoscale devices that synergize the performances and functionalities over different physical domains, such as electromechanics, optomechanics, quantum phononics, RF acoustics, magnetoacoustics, etc. The program continues to embrace the latest progress in nanomechanics, 2.5D/3D heterogeneous integration/packaging, and additive manufacturing. It also aims to capture some of the latest advances in soft materials, environmental sensors and transducers, wearable and wireless healthcare, wearable/implantable/ingestible bio-MEMS, and bio-inspired microsystems.

Areas of Interest: MI is seeking abstracts in the following areas of interest:

  • Optomechanics and Quantum Phononics: Optomechanical/phononic devices and systems for signal sensing, processing, and transduction in classical and quantum regimes.
  • Micro and Nano Biosystems: Soft/flexible materials, wearables, implantables, ingestibles, and bio-inspired microsystems.
  • RF Acoustics and Magnetics: Novel materials (e.g., WBG, UWBG, piezoelectric, ferroelectric, and magnetic materials) and devices for RF acoustic and magnetoacoustic applications.
  • Nanomechanics: Resonant low-dimensional (1D and 2D) materials, nonlinear resonators, and coupled resonators.
  • Microscale Additive Manufacturing: 3D and high-aspect-ratio microscale devices, systems, and packaging based on additive manufacturing techniques, including 3D printing and polymerization.
  • 3D Heterogeneous Integration and Packaging: Advanced integration and packaging techniques, including 2.5D/3D heterogeneous integration, bulk and surface micromachining, and wafer bonding to enable multifunctional devices and systems.

MN1-ThA: RF and Magnetic MEMS

  • Margo Staruch, US Naval Research Laboratory, “Control of Magnetoelastic Properties for Magnetoelectric Magnetic Field Sensors”

MN2-ThA: Bio and Flexible/Wearable Devices

MN1-FrM: Integration and Multiphysics

  • Marcel Pruessner, US Naval Research Laboratory, “MEMS-Enabled Photonic Integrated Circuits”

MN2-FrM: 2D and NEMS

  • Philip Feng, University of Florida, “Optomechanical Resonant Pixels with Metasurface and Phonon Engineering for Uncooled Infrared (IR) Detection”

MN-ThP: MEMS and NEMS Poster Session

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Key Dates

Major Awards Deadline:
March 10, 2025

Student Awards Deadline:
April 14, 2025

Abstract Submission Deadline:
August 18, 2025

Early Registration Deadline:
August 18, 2025

Hotel Deadline:
August 18, 2025

Contact

Yvonne Towse
Conference Administrator
125 Maiden Lane; Suite 15B
New York, N.Y. 10038
yvonne@avs.org

 

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