Submit Your Abstract Now Through - August 18, 2025
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Abstract Submission

Home Abstract Submission

Submit Your Abstract Now Through:
August 18, 2025 (11:59 p.m. ET)

Abstract Submission Guidelines

Please review Steps 1-5 below before entering the online abstract submission site.

  • Step 1

    Before signing up or logging into the online system (in Step 5), please review all of the following steps to ensure you have the information needed to complete the abstract submission process.

    Please Note the Following Requirements Prior to Submission:

    If you are planning to submit multiple abstracts, presenters are limited to one oral and one poster presentation. (Note: they must be different abstracts).

  • Step 2

    Review the session topics from the list below. See the Areas of Interest for each topic (these details will be included as pop-ups for each topic on the submission page) and then choose to submit to the topic’s Oral or Poster Session. Note that the Program Committee will build the final sessions based on submissions during program development.

  • Step 3

    Fill out the abstract content and author details in the system (abstract 2,700 characters max. including grammar and spacing; you may also submit a supplemental 1 page PDF file containing any graphs, charts or pictures you wish to include).

  • Step 4

    Agree to the copyright agreement. If you have questions e-mail yvonne@avs.org.

STEP 5

Due by 11:59 p.m. ET

SUBMIT BY August 18

Author Notification

Acknowledgment that your abstract has been submitted will follow by e-mail shortly after submission, with official acceptance/scheduling emails to be sent by mid-June. Submissions will remain open until August 18.

Topics

2D Materials (2D)
Actinides and Rare Earths (AC)
Advanced Surface Engineering (SE)
AI/ML for Scientific Discovery (AIML)
Applied Surface Science (AS)
Atomic Scale Processing (AP)
AVS Quantum Science Workshop (AQS)
Biomaterial Interfaces (BI)
Biomaterial Plenary (BP)
Chemical Analysis and Imaging of Interfaces (CA)
CHIPS Act (CPS)
Electronic Materials and Photonics (EM)
Exhibitor Technology Spotlight (EW)
Light Sources Sciences (LS)
Magnetic Interfaces and Nanostructures (MI)
MEMS and NEMS (MN)
Nanoscale Science and Technology (NS)
Nanoscale Science and Technology Plenary (NSP)
Plasma Science & Technology (PS)
Quantum Science and Technology (QS)
Spectroscopic Ellipsometry (EL)
Surface Science (SS)
Resilient Semiconductor Manufacturing (SM)
Thin Films (TF)
Undergraduate Posters (UN)
Vacuum Technology (VT)
2D Materials (2D)
  • 2D+EM+NS+QS+SS+TF-WeA: 2D Materials: Synthesis and Processing
  • 2D+AQS+EM+MI+MN+NS+QS+SS+TF-ThM: 2D Materials: Optoelectronics and Moire Excitons
  • 2D+AQS+MI+NS+QS+TF-ThA: 2D Materials: Magnets and Topological Phenomena
Learn More
  • 2D-ThP: 2D Materials Poster Session
  • 2D+AQS+EM+NS+QS+TF-FrM: 2D Materials: Devices and Applications
Actinides and Rare Earths (AC)
  • AC+MI-ThM: Superconductivity, Magnetism, Electron Correlation and Complex Behavior
  • AC+MI-ThA: Early Career and Rising Stars
Learn More
  • AC-ThP: Actinides and Rare Earths Poster Session
  • AC+MI-FrM: Spectroscopy, Spectrometry, 5f Behavior and Forensics
Advanced Surface Engineering (SE)
  • SE-WeM: Advanced Surface Engineering Oral Session
  • SE-ThP: Advanced Surface Engineering Poster Session
Learn More
AI/ML for Scientific Discovery (AIML)
  • AIML1: AI/ML for Scientific Discovery Oral Session
  • AIML2: AI/ML for Scientific Discovery Poster Session
Learn More
Applied Surface Science (AS)
  • AS+BI+CA-MoM: The Power of SIMS
  • AS-MoA: Quantitative Surface Analysis I
  • AS-TuM: Surface Characterization of Energy Materials
Learn More
  • AS-TuA: Theory and Data
  • AS-WeM: Quantitative Surface Analysis II
  • AS-ThP: Applied Surface Science Poster Session
Atomic Scale Processing (AP)
  • AP+PS+TF-WeM: Thermal and Plasma-Enhanced Atomic Layer Deposition
  • AP+PS+TF-WeA: Thermal and Plasma enhanced Atomic Layer Etching
  • AP+AS+EL+EM+PS+TF-ThM: Advancing Atomic Scale Processing through Modeling and Simulation
Learn More
  • AP+PS+TF-ThA: Emerging Applications for Atomic Scale Processing (ALD/ALE) including Precursors and Surface Reactions
  • AP-ThP: Atomic Scale Processing Poster Session
  • AP+EM+PS+TF-FrM: Area Selective Processing and Patterning
AVS Quantum Science Workshop (AQS)
  • AQS-SuA: AVS Quantum Science Workshop Oral Session (ALL-INVITED SESSION)
Learn More
Biomaterial Interfaces (BI)
  • BI1-MoM: Characterization of Biological and Biomaterials Surfaces
  • BI2-MoM: Biomolecules and Biophysics at Interfaces
  • BI1-MoA: Functional Biomaterials and Sensing
Learn More
  • BI2-MoA: Microbes and Biofilms
  • BI-TuA: The Future of Biointerface Science
  • BI-ThP: Biomaterial Interfaces Poster Session
Biomaterial Plenary (BP)
  • BP-SuA: Biomaterials Plenary Session (ALL-INVITED SESSION)
Learn More
Chemical Analysis and Imaging of Interfaces (CA)
  • CA+AS+SS-WeM: Chemical Analysis and Imaging at Interfaces Oral Session
  • CA-WeA: Advances in Experimental and Theoretical Insights Into Material Interfaces
  • CA-ThP: Chemical Analysis and Imaging at Interfaces Poster Session
Learn More
CHIPS Act (CPS)
  • CPS+MS1-MoM: Metrology for Semiconductor Manufacturing
  • CPS+MS2-MoM: Digital Twins and Advanced Packaging for Semiconductor Manufacturing

Learn More

  • CPS+MS-MoA: Semiconductor Manufacturing Workforce Development
  • CPS+MS-ThP: CHIPS Act: Semiconductor Manufacturing Science and Technologies Poster Session
Electronic Materials and Photonics (EM)
  • EM1+AP+CPS+MS+PS+QS+SM+TF-TuM: Emerging Frontiers in Quantum Materials and Devices
  • EM2+AP+QS+TF-TuM: Evolution of Materials and Devices for Energy Harvesting and Conversion
  • EM1+CPS+MS+PS+SM+TF-TuA: Advances in Materials and Processes for Devices and Interconnects (FEOL and BEOL)
  • EM2+AIML+AP+CPS+MS+SM-TuA: Advances in AI and Machine Learning within the Semiconducting Industry
  • EM1+AP+CA+CPS+MS+TF-WeM: Advances in Wide Bandgap Materials and Devices
Learn More
  • EM2+CA+CPS+MS+SE+TF-WeM: Processing Ultra-Wide Band Gap Ga2O3
  • EM1+AP+CPS+MS+PS+SM+TF-WeA: Materials and Devices in Emerging Memories
  • EM2+AP+NS+TF-WeA: Advances in Materials and Devices for Energy Storage
  • EM3+TF-WeA: Materials and Devices for Advanced Photonics and Plasmonics
  • EM-ThP: Electronic Materials and Photonics Poster Session
Exhibitor Technology Spotlight (EW)
  • EW-TuMB: Exhibitor Technology Spotlight Session I
  • EW-TuL: Exhibitor Technology Spotlight Session II
Learn More
Light Sources Sciences (LS)
  • LS-ThP: Light Sources Enabled Science Mini-Symposium Poster Session
  • Learn More
Magnetic Interfaces and Nanostructures (MI)
  • MI+2D-WeA: Magnetic Interfaces and Nanostructures Oral Session
Learn More
MEMS and NEMS (MN)
  • MN1-ThA: RF and Magnetic MEMS
  • MN2-ThA: Bio and Flexible/Wearable Devices
  • MN-ThP: MEMS and NEMS Poster Session
Learn More
  • MN2-FrM: 2D and NEMS
Nanoscale Science and Technology (NS)
  • NS1-MoM: Frontier in Nanoscale Electron, Ion, and Scanning Probe Imaging
  • NS2-MoM: Advanced Nanomaterial for Quantum and Energy Applications
  • NS-MoA: Light-Matter Interactions at the Nanoscale
  • NS1-TuM: AI for Material Discovery and Characterization
Learn More
  • NS2+2D-TuM: Multimodal Techniques in Surface and Interface Engineering at the Nanoscale
  • NS-TuA: Advanced Nanoscale Materials & Device Technologies
  • NS-ThP: Nanoscale Science and Technology Poster Session
Nanoscale Science and Technology Plenary (NSP)
  • NSP-SuA: Nanoscale Science and Technology Plenary Session (ALL-INVITED SESSION)
Learn More
Plasma Science & Technology (PS)
  • PS-MoM: Advanced Logic and EUV Patterning
  • PS-MoA: Plasma Modelling Focused on CCP
  • PS-TuM: Advanced Memory, HARC, and Cryo Etching
  • PS1-TuA: Plasmas in Advanced Packaging
  • PS2-TuA: Sustainability and Plasmas
  • PS-WeM: Plasma Catalysis and Surface Interactions
  • PS1-WeA: Plasmas for Emerging Device Technologies
  • PS2-WeA: Atmospheric Plasma
  • PS3-WeA: ICP Modelling
Learn More
  • PS1-ThM: Plasma Diagnostics
  • PS2-ThM: Plasma Sources
  • PS+AIML-ThA: Plasma Modelling AI/ML
  • PS-ThP: Plasma Science and Technology Poster Session
  • PS1-FrM: Plasma Processes for Coatings and Thin Films
  • PS2-FrM: Plasma in EUV Scanner Technology
  • PS3+TF-FrM: Plasmas and PVD
Quantum Science and Technology (QS)
  • QS1-MoM: Qubit Modalities for Quantum Computing
  • QS2-MoM: Systems, Devices, and Manufacturing Technologies for Quantum Technology
  • QS1-MoA: Advanced Materials for Quantum Information Science
  • QS2-MoA: Surface Engineering for Quantum Applications
  • QS1-TuM: Quantum Simulations and Quantum-Inspired Technologies
Learn More
  • QS2-TuM: Quantum Foundries, Educational Initiatives, Sensing and Metrology
  • QS1-TuA: Interdisciplinary Quantum Applications
  • QS2-TuA: Scalable Fabrication for Quantum Technology
  • QS-ThP: Quantum Science and Technology Mini-Symposium Poster Session
Spectroscopic Ellipsometry (EL)
  • EL-TuM: Spectroscopic Ellipsometry Analysis Methods
  • EL1-TuA: Spectroscopic Ellipsometry Material Applications
Learn More
  • EL2-TuA: Spectroscopic Ellipsometry Novel Methodologies
  • EL-ThP: Spectroscopic Ellipsometry Poster Session
Surface Science (SS)
  • SS-MoA: Photo/Electrochemistry
  • SS+2D-TuM: Complex Phenomena on Surfaces
  • SS-TuA: Heterogeneous Catalysis I
  • SS-WeM: On Surface Reactions
  • SS-WeA: Heterogeneous Catalysis II
Learn More
  • SS-ThM: Surface Electrical, Magnetic, and Optical Properties
  • SS-ThA: Late Breaking Discoveries from the Rising Stars in Surface Science
  • SS-ThP: Surface Science Poster Session
  • SS-FrM: Surface Science of Reduced Dimensional Materials
Resilient Semiconductor Manufacturing (SM)
  • SM1: Resilient Semiconductor Manufacturing Oral Session
  • SM2: Resilient Semiconductor Manufacturing Poster Session
Learn More
Thin Films (TF)
  • TF1-MoM: Fundamentals of Thin Films I
  • TF2-MoM: Characterization of Thin Films
  • TF1-MoA: Thin Films for Energy I
  • TF2-MoA: Thin Films for Energy II
  • TF1+EM-TuM: Thin Films for Energy III
  • TF2-TuM: VSHOP I – Porous Framework Materials & Membranes
  • TF-TuA: VSHOP II – Infiltration Synthesis of Hybrid Materials
Learn More
  • TF1-WeM: VSHOP III – Initiated Chemical Vapor Deposition
  • TF2-WeM: VSHOP IV – Oxidative Chemical Vapor Deposition & Molecular Layer Deposition
  • TF-WeA: Fundamentals of Thin Films II
  • TF+CPS+MS+EM-ThM: Thin Films for Microelectronics I
  • TF+CPS+MS+EM-ThA: Thin Films for Microelectronics II
  • TF-ThP: Thin Film Poster Session
  • TF-FrM: Fundamentals of Thin Films III
Undergraduate Posters (UN)
  • UN-ThP: Undergraduate Poster Session

Learn More

Vacuum Technology (VT)
  • VT1-MoA: Vacuum for Fusion and Large Systems I
  • VT2-MoA: Vacuum for Fusion and Large Systems II
  • VT1-TuM: Measurement, Simulations and Accelerator Vacuum Systems
Learn More
  • VT2-TuM: Measurement, Simulations and Accelerator Vacuum Systems
  • VT-ThP: Vacuum Technology Poster Session

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Key Dates

Major Awards Deadline:
March 10, 2025

Student Awards Deadline:
April 14, 2025

Abstract Submission Deadline:
August 18, 2025

Early Registration Deadline:
August 18, 2025

Hotel Deadline:
August 18, 2025

Contact

Yvonne Towse
Conference Administrator
125 Maiden Lane; Suite 15B
New York, N.Y. 10038
yvonne@avs.org

 

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