Submit Your Abstract Now Through - August 18, 2025
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Division: Thin Film (TF)

Home Division: Thin Film (TF)

The TFD program provides a week-long forum for academic, government, and industrial researchers and practitioners to share new advances in the processing, structure, properties, and applications of thin films. Topics span from the fundamental science of thin film processing and characterization to the scale-up and commercialization of thin film deposition equipment and devices. Early in the week, TF sessions highlight fundamental scientific advances in controlling crystalline phases in thin films and advances in thin film technology for energy applications. Mid-week, the TF program hosts several sessions on the vapor deposition of organic, polymeric, and hybrid materials. At the end of the week, TF sessions focus on the use of thin films in microelectronics, including advances in ferroelectric and wide-bandgap thin films. The TF poster session on Thursday evening will span all these topical areas. Joint programming on atomic layer processing can be found early in the week in the Atomic Scale Processing Mini-Symposium, while early to mid-week joint programming on the use of thin films in microelectronics can be found within the Chips Act Mini-Symposium (early) and the Electronic Materials and Photonics Division program (mid).

Finally, on Monday evening, TF will also again host its popular student-focused session in which James Harper Award finalists will share their work in interactive “TED Talk” style presentations.

TF1-MoM: Fundamentals of Thin Films I

  • Joseph Falson, Caltech, “Reduced Oxide Epitaxy at Very High Temperatures”

TF2-MoM: Characterization of Thin Films

  • Megan Holtz, Colorado School of Mines, “Mapping Nanoscale Polarity Using Scanning Nanobeam Electron Diffraction Techniques”

TF1-MoA: Thin Films for Energy I

  • Arrelaine Dameron, Forge Nano Inc, “Manufacturing-Scale Powder Atomic Layer Deposition for Battery Applications”
  • Reeja Jayan, Carnegie Mellon University, “Vapor Phase Methods for Tailoring Electrode−Electrolyte Interfaces in Lithium-Ion Batteries”
  • Paul Poodt, SparkNano and Eindhoven University of Technology, Netherlands, “Enabling Scalable Sustainable Energy Devices via Spatial Atomic Layer Deposition”

TF2-MoA: Thin Films for Energy II

  • Feng Yan, Arizona State University, “Interface Engineering for the Highly Efficient Antimony Chalcogenides Thin Film Energy Devices”

TF1+EM-TuM: Thin Films for Energy III

  • Marianna Kemell, University of Helsinki, Finland, “Atomic Layer Deposition of Metal Iodides”

TF2-TuM: VSHOP I – Porous Framework Materials & Membranes

  • Sarah Park, Pohang University of Science and Technology (POSTECH), Republic of Korea, “Synthesis of Electrically Conductive Metal-Organic Framework Thin Films”

TF-TuA: VSHOP II – Infiltration Synthesis of Hybrid Materials

  • Jolien Dendooven, Ghent University, Belgium, “Ruthenium Tetroxide as a Versatile and Selective Precursor for Sequential Infiltration Synthesis of Ru and RuO2”
  • Jeffrey Elam, Argonne National Laboratory, “Functionalization of Polymer Membranes for Water Treatment using Chemical Vapors”

TF1-WeM: VSHOP III – Initiated Chemical Vapor Deposition

  • Sung Gap Im, Korea Advanced Institute of Science and Technology (KAIST), Republic of Korea, “Vapor-Phase Deposited Functional Polymer Films for Electronics and Biomedical Device Applications”
  • Jessie Yu Mao, Oklahoma State University, “Surface Roughness Control in Vapor-Deposited Nanocoatings for Bio-Adhesion Mitigation”

TF2-WeM: VSHOP IV – Oxidative Chemical Vapor Deposition & Molecular Layer Deposition

TF-WeA: Fundamentals of Thin Films II

TF+CPS+MS+EM-ThM: Thin Films for Microelectronics I

  • Ageeth Bol, University of Michigan, Ann Arbor, “Towards Low-Resistance p-Type Contacts to 2D Transition Metal Dichalcogenides Using Plasma-Enhanced Atomic Layer Deposition”
  • Asif Khan, Georgia Institute of Technology, USA, “Pushing the Limits of Vertical NAND Storage Technology with ALD-based Ferroelectrics”
  • Nian-Xiang Sun, Department of Electrical and Computer Engineering, Northeastern University, “Integrated Magnetoacoustic Isolator with Giant Non-Reciprocity”

TF+CPS+MS+EM-ThA: Thin Films for Microelectronics II

  • Francois Fabreguette, Micron Technology, “Area Selective Deposition Processing in the Memory Industry: How to Take Advantage of the High-Volume Manufacturing Environment”

TF-ThP: Thin Film Poster Session

TF-FrM: Fundamentals of Thin Films III

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Key Dates

Major Awards Deadline:
March 10, 2025

Student Awards Deadline:
April 14, 2025

Abstract Submission Deadline:
August 18, 2025

Early Registration Deadline:
August 18, 2025

Hotel Deadline:
August 18, 2025

Contact

Yvonne Towse
Conference Administrator
125 Maiden Lane; Suite 15B
New York, N.Y. 10038
yvonne@avs.org

 

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