The PSTD program showcases cutting-edge advancements in plasma science, encompassing fundamental research in plasma physics and chemistry, plasma-matter interactions, and innovative applications in plasma processing. Our vibrant international community, comprising experts from academia, national laboratories, and industry, convenes to explore the latest breakthroughs in plasma research. Key focus areas include semiconductor fabrication, catalysis, artificial intelligence and machine learning (AI/ML), advanced packaging, plasma sources and diagnostics, sustainability, and extreme ultraviolet (EUV) technology, where plasma serves as a critical enabling tool.
The PSTD program spans the entire week, featuring a comprehensive schedule of oral presentations in morning and afternoon sessions, complemented by an extensive poster session on Thursday evening. The week commences with Monday morning talks on plasma processes for advanced logic and EUV patterning, highlighted by three invited speakers. The afternoon features a plasma modeling session focused on capacitively coupled plasma (CCP) reactors, led by the 2024 Plasma Prize recipient, Dr. Shahid Rauf. Tuesday morning sessions address plasma processes for advanced memory and cryogenic plasma processing, followed by afternoon discussions on advanced packaging and sustainability.
Wednesday includes a morning session on catalysis, with afternoon sessions dedicated to emerging devices, atmospheric plasmas, and inductively coupled plasma (ICP) modeling. Thursday morning focuses on plasma sources, diagnostics, and control, while the afternoon hosts an AI/ML session and a special FLASH session, where poster presenters deliver concise 2–3-minute previews of their work ahead of the evening’s poster session. The program concludes on Friday morning with the AVS John Thornton Award lecture by Prof. Ellen Fisher, alongside sessions on plasma applications in chemical vapor deposition (CVD), physical vapor deposition (PVD), and EUV technology.
Throughout the week, invited talks will cover critical topics, including atomic-level control of plasma etching, nonthermal plasmas for advanced logic, memory, and EUV applications, plasma-surface interaction control, plasma damage mitigation, and comprehensive modeling sessions spanning CCP, ICP, and AI/ML applications. Additional highlights include advancements in plasma-enabled advanced packaging, catalysis, and deposition. The program also features presentations by PSTD student finalists competing for the prestigious Coburn and Winters Student Award. Plasma-related topics will also appear in concurrent sessions, such as Atomic Scale Processing (AP) and Electronic Materials and Photonics (EM1).
Call for Late Breaking Abstracts: Submissions are accepted until August 18, 2025.
Plasma Etching, Deposition, and Processing for Advanced Device Fabrication: State-of-the-art front (FEOL) and back (BEOL) end-of-line patterning and processing for logic devices, emerging memory applications, quantum devices, and photonics; advanced packaging, chiplets & heterogeneous integration.
Plasma Enhanced Atomic Layer Processing: Area selective deposition, characterization, and metrology to enable atomic scale processing, atomic layer process chemistry, surface reactions, and atomic layer etching. Novel thin film deposition processes and material synthesis studies are also encouraged.
Plasmas and Plasma-Surface Interactions – Experiment and Modeling: Fundamental understanding of plasma-surface interactions, modeling, and simulation challenges associated with plasma-based materials synthesis, processing, and etching; kinetic, fluid, hybrid, and data-driven models; control; and experimental validation of simulations.
Plasma Sources, Diagnostics, Sensing, and Control: Novel plasma generation schemes and (ion beam) sources at low and high pressures; plasma diagnostics; pulsed plasmas and waveform shaping; process sensing and control schemes.
Plasmas for Chemical, Energy, and Sustainable Applications: Emerging venues where plasmas provide unique advantages in chemical, environmental, energy, and biological applications. New plasma processes for sustainable technologies (chemical conversion, batteries, fuel cells, electrochemistry, photovoltaics, low GWP gases) and atmospheric pressure processing. Making today’s processes more energy-efficient and environmentally friendly.
Areas of Interest: PS is seeking abstracts in the following areas:
- Plasma Processing for Advanced Logic and Memory Device Fabrication
- Plasma Processing for EUV and High-NA EUV
- Plasma Processing for Advanced Packaging Technologies
- Plasma Processing for Emerging Device Technologies
- Area Selective Processing and Patterning
- Plasma ALD/ALE
- Plasma Processes for Coatings and Thin Films
- Plasma Surface Interactions
- Plasma Modeling
- Plasma Sources, Diagnostics, Sensing and Control
- Atmospheric Pressure Plasmas and their Applications
- Plasma Chemistry, Catalysis, Environment and Sustainability
PS-MoM: Advanced Logic and EUV Patterning
- Koji Eriguchi, Kyoto University, Japan, “Current Status and Future Perspectives of Plasma-Induced Damage and its Characterization”
- Sara Paolillo, IMEC, Belgium, “Dry Etch Challenges Towards the High NA EUV Lithography Patterning Era”
- Cedric Thomas, Tokyo Electron America, Inc., “Challenges and Perspectives in Process Control for Next Generation Devices”
PS-MoA: Plasma Modelling Focused on CCP
- Vladimir Kolobov, University of Alabama at Huntsville, “Hybrid Kinetic-Fluid Methods of Plasma Modeling”
- Shahid Rauf, Applied Materials, Inc., “Plasma Prize 2024 Award Talk: Some Tales from Our Model Validation Adventures”
PS-TuM: Advanced Memory, HARC, and Cryo Etching
- Christophe Cardinaud, Nantes Université – CNRS-IMN, France, “Does the Etching of Exotic Materials or the Implementation of Cryogenic Conditions Call Into Question the Fundamentals of Plasma-Surface Interaction?”
PS1-TuA: Plasmas in Advanced Packaging
- Fee Li Lie, IBM Research Division, Albany, NY, “Plasma processing opportunities in the era of Chiplet and Advanced Packaging for AI application “
- James Papanu, Tokyo Electron Corporate Innovation Division / Tokyo Electron Kyushu, Ltd., Japan, “Critical Plasma Processing Steps for Fusion and Hybrid Bonding Applications”
PS2-TuA: Sustainability and Plasmas
- David Speed, GlobalFoundries, “Fluorinated Gases in Plasma Etch: Challenges, Accomplishments, and Opportunities”
PS-WeM: Plasma Catalysis and Surface Interactions
- David Pai, Laboratoire de Physique des Plasmas (CNRS, Ecole Polytechnique, Institut Polytechnique de Paris, Sorbonne Université), France, “in Situ/Operando Diagnostics of Liquids and Catalysts in Contact with Plasmas”
- Michele Sarazen, Princeton University, “Elucidating Complex Interactions in Non-Thermal Plasma-Assisted Reactions on (Supported) Porous Catalysts”
- Wallis Scholl, Colorado School of Mines, “Interaction of Etching Plasmas with Polyurea Films deposited by Molecular Layer Deposition for Surface and Sidewall Passivation”
- Hartmut Wiggers, University of Duisburg-Essen, Germany, “Gas-Phase Plasma Synthesis as a Method for Producing Nanomaterials with Special Properties”
PS1-WeA: Plasmas for Emerging Device Technologies
- Patricia Pimenta Barros, Univ. Grenoble Alpes, CEA, LETI, France, “Main Etch Challenges in the GaN-based Devices”
PS2-WeA: Atmospheric Plasma
PS3-WeA: ICP Modelling
- Yuri Barsukov, Lam Research Corporation, “Quantum Chemistry and Integrated Modeling for Understanding the Mechanisms of Selective and Cryogenic Atomic-Scale Etching “
PS1-ThM: Plasma Diagnostics
- Jente Wubs, Eindhoven University of Technology, Netherlands, “Absolute Atomic Density Measurements in Hydrogen- and Oxygen-Containing Plasmas for Atomic-Scale Processing”
PS2-ThM: Plasma Sources
PS+AIML-ThA: Plasma Modelling AI/ML
- Abhishek Verma, Applied Materials, Inc., “Machine Learning for Low Temperature Plasma Applications”
PS-ThP: Plasma Science and Technology Poster Session
PS1-FrM: Plasma Processes for Coatings and Thin Films
- Ellen R. Fisher, University of New Mexico, “AVS John Thornton Award Talk: Creating a Dream Team: Thin Films, Plasma Chemistry, Holistic Approaches, and Non-Traditional Pathways”
PS2-FrM: Plasma in EUV Scanner Technology
- Seth Brussaard, ASML
PS3+TF-FrM: Plasmas and PVD